Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 022427/0983 | |
| Pages: | 2 |
| | Recorded: | 03/24/2009 | | |
| Attorney Dkt #: | 1991P58004US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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04/20/1993
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Application #:
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07896495
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Filing Dt:
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06/02/1992
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Title:
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DIE PRESENTATION SYSTEM FOR DIE BONDER
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Patent #:
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Issue Dt:
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01/02/2007
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Application #:
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10081028
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Filing Dt:
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02/21/2002
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Publication #:
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Pub Dt:
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05/08/2003
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Title:
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MECHANISM FOR EXCHANGING CHIP-CARRIER PLATES FOR USE IN A HYBRID CHIP-BONDING MACHINE
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Patent #:
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Issue Dt:
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09/07/2004
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Application #:
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10358422
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Filing Dt:
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02/04/2003
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Publication #:
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Pub Dt:
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05/27/2004
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Title:
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CHIP-TRANSFERRING STATION FOR A BONDING MACHINE
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Assignee
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| WITTELSBACHERPLATZ 2 |
| MUNICH, GERMANY DE-80333 |
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Correspondence name and address
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SIEMENS CORPORATION
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170 WOOD AVENUE SOUTH
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ISELIN, NJ 08830
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