Patent Assignment Details
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| Reel/Frame: | 063664/0983 | |
| Pages: | 4 |
| | Recorded: | 05/16/2023 | | |
| Attorney Dkt #: | R088-0231USC1 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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17402987
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Filing Dt:
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08/16/2021
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Publication #:
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Pub Dt:
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12/02/2021
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Title:
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Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate
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Assignee
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| 23221 E KNOX AVE |
| LIBERTY LAKE, WASHINGTON 99019 |
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Correspondence name and address
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LEE & HAYES, PC
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601 WEST RIVERSIDE, SUITE 1400
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SPOKANE, WA 99201
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06/23/2024 11:18 PM
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