Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 022288/0984 | |
| Pages: | 3 |
| | Recorded: | 02/23/2009 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
10
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Patent #:
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Issue Dt:
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03/26/2002
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Application #:
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09565541
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Filing Dt:
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05/05/2000
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Title:
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Method for fabricating a microelectronic fabrication having formed therein a redistribution structure
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Patent #:
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Issue Dt:
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09/10/2002
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Application #:
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09565962
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Filing Dt:
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05/05/2000
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Title:
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MICROELECTRONIC FABRICATION HAVING FORMED THEREIN TERMINAL ELECTRODE STRUCTURE PROVIDING ENHANCED PASSIVATION AND ENHANCED BONDABILITY
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Patent #:
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Issue Dt:
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10/21/2003
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Application #:
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09693571
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Filing Dt:
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10/20/2000
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Title:
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METHOD FOR FORMING PATTERNED POLYIMIDE LAYER
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Patent #:
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Issue Dt:
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01/06/2004
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Application #:
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10336497
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Filing Dt:
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01/02/2003
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Title:
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STACKED PAIRED DIE PACKAGE AND METHOD OF MAKING THE SAME
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Patent #:
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Issue Dt:
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01/25/2005
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Application #:
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10341993
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Filing Dt:
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01/13/2003
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Publication #:
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Pub Dt:
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07/15/2004
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Title:
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APPARATUS AND METHOD FOR BUBBLE-FREE APPLICATION OF A RESIN TO A SUBSTRATE
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Patent #:
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Issue Dt:
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08/31/2004
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Application #:
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10342220
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Filing Dt:
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01/13/2003
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Publication #:
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Pub Dt:
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07/15/2004
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Title:
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FLAT-TOP BUMPING STRUCTURE AND PREPARATION METHOD
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Patent #:
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Issue Dt:
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03/07/2006
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Application #:
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10370827
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Filing Dt:
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02/21/2003
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Publication #:
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Pub Dt:
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08/26/2004
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Title:
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METHOD FOR FORMING COPPER BUMP ANTIOXIDATION SURFACE
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Patent #:
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Issue Dt:
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07/05/2005
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Application #:
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10461236
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Filing Dt:
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06/13/2003
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Publication #:
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Pub Dt:
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12/16/2004
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Title:
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METHOD OF MAKING AN ULTIMATE LOW DIELECTRIC DEVICE
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Patent #:
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Issue Dt:
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11/28/2006
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Application #:
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10815496
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Filing Dt:
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03/31/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Title:
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FLEXIBLE MULTI-CHIP MODULE AND METHOD OF MAKING THE SAME
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Patent #:
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Issue Dt:
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04/24/2007
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Application #:
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10816413
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Filing Dt:
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03/31/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Title:
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WAFER LEVEL MOUNTING FRAME FOR BALL GRID ARRAY PACKAGING, AND METHOD OF MAKING AND USING THE SAME
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Assignee
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| 66 CHUNG SHAN ROAD |
| TU-CHENG, TAIPEI HSIEN, TAIWAN |
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Correspondence name and address
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CLIFFORD O. CHI
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PCE INDUSTRY, INC.
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458 E. LAMBERT RD.
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FULLERTON, CA 92835
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