Patent Assignment Details
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Reel/Frame: | 010418/0985 | |
| Pages: | 3 |
| | Recorded: | 10/07/1999 | | |
Conveyance: | (ASSIGNMENT OF ASSIGNOR'S INTEREST)RE-RECORD TO CORRECT THE NUMBER OF MICROFILM PAGES FROM 2 TO 3 AT REEL 010320, FRAME 0280. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/13/2001
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Application #:
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09414986
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Filing Dt:
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10/07/1999
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Title:
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MULTI-CHIP SEMICONDUCTOR PACKAGE
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Assignees
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 3, LI-HSIN ROAD II |
HSINCHU, TAIWAN R.O.C |
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 3, LI-HSIN ROAD II |
HSINCHU, TAIWAN R.O.C |
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Correspondence name and address
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HICKMAN STEPHENS & COLEMAN, LLP
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PAUL L. HICKMAN
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P.O. BOX 52037
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PALO ALTO, CA 94303-0746
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