Patent Assignment Details
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| Reel/Frame: | 013710/0985 | |
| Pages: | 2 |
| | Recorded: | 01/28/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/23/2004
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Application #:
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10352042
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Filing Dt:
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01/28/2003
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Publication #:
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Pub Dt:
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10/16/2003
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Title:
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WAFER-LEVEL PACKAGE WITH A CAVITY AND FABRICATING METHOD THEREOF
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Assignee
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| 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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LOWE HAUPTMAN GILMAN ET AL.
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BENJAMIN J. HAUPTMAN
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1700 DIAGONAL ROAD, SUITE 300
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ALEXANDRA, VA 22314
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