Patent Assignment Details
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Reel/Frame: | 032766/0986 | |
| Pages: | 6 |
| | Recorded: | 04/28/2014 | | |
Attorney Dkt #: | TUE-117/PCT/US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/03/2016
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Application #:
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14354647
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Filing Dt:
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04/28/2014
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Publication #:
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Pub Dt:
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10/09/2014
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Title:
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Wafer scale technique for interconnecting vertically stacked dies
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Assignee
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DEN DOLECH 2 |
EINDHOVEN, NETHERLANDS 5612 AZ |
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Correspondence name and address
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RON JACOBS
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550 S. CALIFORNIA AVE.
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SUITE 300
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PALO ALTO, CA 94306
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