Patent Assignment Details
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Reel/Frame: | 005817/0987 | |
| Pages: | 2 |
| | Recorded: | 08/23/1991 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/23/1993
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Application #:
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07749269
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Filing Dt:
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08/23/1991
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Title:
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MULTILAYER WIRING METHOD OF ON-CHIP MODIFICATION FOR AN LSI
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Assignee
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A CORPORATION OF JAPAN |
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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KENYON & KENYON
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EDWARD W. GREASON
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ONE BROADWAY
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NEW YORK, NY 10004
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