Patent Assignment Details
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Reel/Frame: | 005505/0989 | |
| Pages: | 5 |
| | Recorded: | 11/08/1990 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/23/1991
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Application #:
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07529827
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Filing Dt:
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05/29/1990
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Title:
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INTEGRATED CIRCUIT SUBSTRATE WITH CONTACTS THEREON FOR A PACKAGE STRUCTURE
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Assignee
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A CORP. OF NY |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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AZIZ M. AHSAN
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IBM CORP., DEPT. 901, BLDG. 300/482
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RT. 52
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HOPEWELL JUNCTION, NY 12533
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