Patent Assignment Details
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| Reel/Frame: | 015075/0990 | |
| Pages: | 4 |
| | Recorded: | 08/20/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/08/2006
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Application #:
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10871313
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Filing Dt:
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06/18/2004
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Title:
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SOLDER PAD CONFIGURATION FOR USE IN A MICRO-ARRAY INTEGRATED CIRCUIT PACKAGE
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Assignee
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| 2900 SEMICONDUCTOR DR. |
| SANTA CLARA, CALIFORNIA 95051 |
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Correspondence name and address
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BEYER WEAVER & THOMAS, LLP
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JON Y. IKEGAMI
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P.O. BOX 778
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BERKELEY, CA 94704-0778
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