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Patent Assignment Details
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Reel/Frame:014688/0991   Pages: 3
Recorded: 11/10/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/18/2006
Application #:
10703482
Filing Dt:
11/10/2003
Publication #:
Pub Dt:
05/12/2005
Title:
METHOD FOR FORMING BOND PAD OPENINGS
Assignor
1
Exec Dt:
10/31/2003
Assignee
1
1 SILICON DRIVE, SAMA JAYA FREE
INDUSTRIAL ZONE, KUCHING
SARAWAK, MALAYSIA 93350
Correspondence name and address
GEORGE D. LIU
2101 CRYSTAL PLAZA ARC
PMB 400
ARLINGTON, VIRGINIA 22202

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