Patent Assignment Details
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Reel/Frame: | 023411/0992 | |
| Pages: | 4 |
| | Recorded: | 10/22/2009 | | |
Attorney Dkt #: | 507635 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12604232
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Filing Dt:
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10/22/2009
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Publication #:
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Pub Dt:
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06/17/2010
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Title:
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Semiconductor Package Having Support Chip And Fabrication Method Thereof
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Assignee
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95-1, WONNAM-RI, EUMBONG-MYEON |
CHUNGCHEONGNAMDO |
ASAN-SI, KOREA, REPUBLIC OF 336-864 |
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Correspondence name and address
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SUN Y. PAE
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2215 PERRYGREEN WAY
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REINHART BOERNER VAN DEUREN P.C.
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ROCKFORD, IL 61107
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