Patent Assignment Details
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| Reel/Frame: | 014842/0993 | |
| Pages: | 2 |
| | Recorded: | 12/23/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10743454
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Filing Dt:
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12/23/2003
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Publication #:
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Pub Dt:
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03/03/2005
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Title:
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Method for planarizing a surface of a semiconductor wafer
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Assignee
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| 891-10 DAECHI-DONG |
| GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF |
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Correspondence name and address
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PILLSBURY WINTHROP LLP
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GLENN T. BARRETT
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P.O. BOX 10500
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MCLEAN, VA 22102
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