Patent Assignment Details
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| Reel/Frame: | 048748/0993 | |
| Pages: | 3 |
| | Recorded: | 04/01/2019 | | |
| Attorney Dkt #: | PB19-0007 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/14/2020
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Application #:
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16371134
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Filing Dt:
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04/01/2019
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Publication #:
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Pub Dt:
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01/02/2020
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Title:
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METHOD OF BONDING TERMINAL OF SEMICONDUCTOR CHIP USING SOLDER BUMP AND SEMICONDUCTOR PACKAGE USING THE SAME
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Assignee
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| 102, GILJU-RO 425BEON-GIL |
| BUCHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 14487 |
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Correspondence name and address
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PARK, KIM & SUH, LLC
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1875 CENTURY PARK EAST
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SUITE #600
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LOS ANGELES, CA 90067
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