Patent Assignment Details
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Reel/Frame: | 011723/0994 | |
| Pages: | 3 |
| | Recorded: | 04/19/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/02/2004
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Application #:
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09838752
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Filing Dt:
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04/19/2001
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Publication #:
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Pub Dt:
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09/12/2002
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Title:
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PACKAGE OF A CHIP WITH BEVELED EDGES
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Assignee
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EXPORT PROCESSING ZONE |
26, CHIN 3RD. RD., 811, NANTZE |
KAOHSIUNG, TAIWAN R.O.C |
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Correspondence name and address
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J. C. PATENTS, INC.
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JIAWEI HUANG
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1340 REYNOLDS AVE., SUITE 114
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IRVINE, CA 92614
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