Patent Assignment Details
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Reel/Frame: | 008480/0996 | |
| Pages: | 3 |
| | Recorded: | 03/25/1997 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/12/1999
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Application #:
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08823955
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Filing Dt:
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03/25/1997
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING MULTI-LAYER WIRING STRUCTURE WITH DIFFUSION PREVENTING FILM
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Assignee
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72 HORIKAWA-CHO, SAIWAI-KU |
KAWASAKI-SHI, JAPAN |
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Correspondence name and address
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LOEB & LOEB, LLP
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ROGER R. WISE
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10100 SANTA MONICA BOULEVARD, SUITE 2200
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LOS ANGELES, CA 90067-4164
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