Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
06/26/2018
|
Application #:
|
15326401
|
Filing Dt:
|
01/13/2017
|
Publication #:
|
|
Pub Dt:
|
07/27/2017
| | | | |
Inventor:
|
Wanchun DING
|
Title:
|
FABRICATING METHOD FOR WAFER-LEVEL PACKAGING
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO. 288, CHONGCHUAN ROAD, CHONGCHUAN DISTRICT |
NANTONG, CHINA 226006 |
|
|
|
ANOVA LAW GROUP, PLLC |
21351 GENTRY DRIVE, SUITE 150 |
STERLING, VA 20166 |
|
|
Search Results as of:
06/25/2024 12:08 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|