Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/17/2018
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Application #:
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15172667
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Filing Dt:
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06/03/2016
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Publication #:
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Pub Dt:
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09/29/2016
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Inventors:
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Sathish Veeraraghavan, Pradeep Vukkadala, Jaydeep Sinha, Haiguang Chen, Michael Kirk
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Title:
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System and Method to Emulate Finite Element Model Based Prediction of In-Plane Distortions Due to Semiconductor Wafer Chucking
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE TECHNOLOGY DRIVE |
| MILPITAS, CALIFORNIA 95035 |
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| SUITER SWANTZ/KLA JOINT CUSTOMER NUMBER |
| 14301 FNB PARKWAY |
| SUITE 220 |
| OMAHA, NE 68154-5299 |
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