Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/17/2018
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Application #:
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14937890
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Filing Dt:
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11/11/2015
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Publication #:
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Pub Dt:
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05/11/2017
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Inventors:
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Chee Pin T'NG, Sai Mun LEE
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Title:
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APPARATUS AND SENSOR CHIP COMPONENT ATTACHING METHOD
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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PHASE III BAYAN LEPAS FREE INDUSTRIAL ZONE |
PENANG, MALAYSIA |
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WINSTON HSU |
P.O.BOX 506 |
MERRIFIELD, VA 22116 |
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