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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/07/2018
Application #:
15660432
Filing Dt:
07/26/2017
Inventors:
Yoon-jae Kim, Ho-young KIM, Dong-kwon KIM, Jin-hyuk YOO, Woo-jin JUNG
Title:
Semiconductor Devices Utilizing Capping Layers with Multiple Widths and Methods of Manufacturing the Same
Assignment: 1
Reel/Frame:
043104/0680Recorded: 07/26/2017Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/29/2017
Exec Dt:
06/29/2017
Exec Dt:
06/29/2017
Exec Dt:
06/29/2017
Exec Dt:
06/30/2017
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
GYEONGGI-DO
SUWON-SI, KOREA, REPUBLIC OF 16677
Correspondent:
MYERS BIGEL, P.A.
4140 PARKLAKE AVENUE
SUITE 600
RALEIGH, NC 27612

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