Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/21/2018
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Application #:
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15585166
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Filing Dt:
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05/03/2017
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Inventors:
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Wen-Fang Liu, Shao-Chien Lee, Chen-Wei Tseng, Zong-Hua Li
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Title:
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CHIP PACKAGE CIRCUIT BOARD MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.38, XINGBANG RD., KWEI-SAN INDUSTRIAL ZONE |
| TAOYUAN CITY, TAIWAN 333 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, TAIWAN |
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