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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/21/2018
Application #:
15475219
Filing Dt:
03/31/2017
Inventors:
Zhiguo Qian, Kemal Aygun
Title:
Interposer structures, semiconductor assembly and methods for forming interposer structures
Assignment: 1
Reel/Frame:
042126/0322Recorded: 03/31/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/28/2017
Exec Dt:
03/01/2017
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
MANI ARABI C/O 2SPL PATENTANWAELTE
LANDAUBOGEN 3
MUNICH, 81373 GERMANY

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