Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/28/2018
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Application #:
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15497309
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Filing Dt:
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04/26/2017
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Publication #:
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Pub Dt:
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10/26/2017
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Inventors:
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Jamie Rieg, Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek
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Title:
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HIGH SPEED SOLDER DEPOSITION AND REFLOW FOR A PRINTED FLEXIBLE ELECTRONIC MEDIUM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 161 WORCESTER ROAD |
| FRAMINGHAM, MASSACHUSETTS 01701 |
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| MCDONALD HOPKINS LLC |
| 600 SUPERIOR AVENUE |
| SUITE 2100 |
| CLEVELAND, OH 44114 |
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