Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
09/11/2018
|
Application #:
|
15460271
|
Filing Dt:
|
03/16/2017
|
Publication #:
|
|
Pub Dt:
|
06/28/2018
| | | | |
Inventors:
|
Yi-Feng Pu, Po-Yu Cheng, Tzu-Shu Lin
|
Title:
|
PACKAGING STRUCTURE AND PACKAGING METHOD OF ELECTRONIC PRODUCT
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO. 25, GUANGPU W. RD., GUANGZHOU SCIENCE CITY |
GUANGZHOU HI-TECH INDUSTRIAL DEVELOPMENT ZONE |
GUANGZHOU, CHINA |
|
|
22F, 392, RUEY KUANG ROAD, NEIHU |
TAIPEI, TAIWAN 114 |
|
|
|
MCCLURE, QUALEY & RODACK, LLP |
3100 INTERSTATE NORTH CIRCLE |
SUITE 150 |
ATLANTA, GA 30339 |
|
|
Search Results as of:
09/22/2024 03:05 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|