Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/02/2018
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Application #:
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15146741
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Filing Dt:
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05/04/2016
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Publication #:
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Pub Dt:
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11/09/2017
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Inventors:
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Chih-Fan Hu, En Chan Chen, Chang-Sheng Hsu, Chia-Wei Lee, Shih-Wei Li
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Title:
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MICROELECTROMECHANICAL SYSTEM STRUCTURE INCLUDING THERMAL STABILITY LAYER WHOSE MATERIAL HAS HIGHER GROWTH TEMPERATURE, AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| J.C. PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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