Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/16/2018
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Application #:
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15588690
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Filing Dt:
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05/07/2017
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Publication #:
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Pub Dt:
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08/24/2017
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Inventors:
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Che-Ya Chou, Kun-Ting Hung, Chia-Hao Yang, Nan-Cheng Chen
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Title:
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SEMICONDUCTOR PACKAGE INCORPORATING REDISTRIBUTION LAYER INTERPOSER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN |
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WINSTON HSU |
5F., NO.389, FUHE RD., YONGHE DIST., |
NEW TAIPEI CITY, TAIWAN |
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