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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10109563
Issue Dt:
10/23/2018
Application #:
15399234
Filing Dt:
01/05/2017
Publication #:
20180190576
Pub Dt:
07/05/2018
Inventors:
Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag et al
Title:
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
Assignment: 1
Reel/Frame:
040866/0250Recorded: 01/05/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
RODRIGUEZ, RENNIER
Exec Dt:
12/14/2016
AGUDON, AIZA MARIE
Exec Dt:
12/14/2016
TALLEDO, JEFFERSON
Exec Dt:
12/08/2016
MANALO, MOONLORD
Exec Dt:
12/08/2016
CADAG, ELA MIA
Exec Dt:
12/08/2016
SEGUIDO, RAMMIL
Exec Dt:
12/08/2016
Assignee:
STMICROELECTRONICS, INC.
NO. 9 MOUNTAIN DRIVE, LIGHT INDUSTRY & SCIENCE PARK II
BRGY LA MESA
CALAMBA CITY, PHILIPPINES 4027
Correspondent:
JOHN KARLEN
701 FIFTH AVE
SUITE 5400
SEATTLE, WA 98104
Assignment: 2
Reel/Frame:
068025/0112Recorded: 07/18/2024Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
STMICROELECTRONICS, INC.
Exec Dt:
07/01/2024
Assignee:
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39
PLAN-LES-OUATES
GENEVA, SWITZERLAND 1228
Correspondent:
RAJ K. KRISHNAN
STMICROELECTRONICS, INC.
750 CANYON DRIVE, SUITE 300
COPPELL, TX 75019

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