Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/23/2018
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Application #:
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15226735
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Filing Dt:
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08/02/2016
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Inventors:
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Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung Moon Kim et al
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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WONG & REES LLP |
4340 STEVENS CREEK BLVD. |
SUITE 106 |
SAN JOSE, CA 95129 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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10 ANG MO KIO STREET 65 |
#04-08/09 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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WONG & REES LLP |
4340 STEVENS CREEK BLVD. |
SUITE 106 |
SAN JOSE, CA 95129 |
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06/14/2024 09:22 AM
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