Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/06/2018
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Application #:
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15166185
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Filing Dt:
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05/26/2016
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Publication #:
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Pub Dt:
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12/01/2016
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Inventors:
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Chia-Chung Wang, Charles W. C. Lin
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Title:
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THERMALLY ENHANCED FACE-TO-FACE SEMICONDUCTOR ASSEMBLY WITH BUILT-IN HEAT SPREADER AND METHOD OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3FL., 157 LI-TE ROAD, PEITOU DIST. |
| TAIPEI, TAIWAN 11259 |
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| CHAO-CHANG DAVID PAI |
| 1001 4TH AVENUE, SUITE 3200 |
| SEATTLE, WA 98154 |
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