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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/27/2018
Application #:
15853839
Filing Dt:
12/24/2017
Inventor:
Li-Yi CHEN
Title:
METHOD FOR BINDING MICRO DEVICE TO CONDUCTIVE PAD
Assignment: 1
Reel/Frame:
044480/0287Recorded: 12/25/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/22/2017
Assignee:
SERTUS CHAMBERS, P.O. BOX603
APIA, SAMOA
Correspondent:
CKC & PARTNERS CO., LTD.
ROOM 1901, 19/F, LEE GARDEN ONE,
33 HYSAN AVENUE, CAUSEWAY BAY
HONG KONG, HONG KONG

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