Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/27/2018
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Application #:
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15853839
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Filing Dt:
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12/24/2017
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Inventor:
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Li-Yi CHEN
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Title:
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METHOD FOR BINDING MICRO DEVICE TO CONDUCTIVE PAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SERTUS CHAMBERS, P.O. BOX603 |
| APIA, SAMOA |
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| CKC & PARTNERS CO., LTD. |
| ROOM 1901, 19/F, LEE GARDEN ONE, |
| 33 HYSAN AVENUE, CAUSEWAY BAY |
| HONG KONG, HONG KONG |
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