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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/18/2018
Application #:
15599477
Filing Dt:
05/19/2017
Publication #:
Pub Dt:
03/15/2018
Inventors:
Nan-Chun Lin, Hung-Hsin Hsu
Title:
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR AND A MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
042462/0051Recorded: 05/23/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/21/2017
Exec Dt:
03/15/2017
Assignee:
NO.26, DATONG RD., HUKOU TOWNSHIP,
HSINCHU COUNTY, TAIWAN 303
Correspondent:
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
TAIPEI, 100 TAIWAN

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