Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/18/2018
|
Application #:
|
15599477
|
Filing Dt:
|
05/19/2017
|
|
Publication #:
|
|
Pub Dt:
|
03/15/2018
| | | | |
|
Inventors:
|
Nan-Chun Lin, Hung-Hsin Hsu
|
|
Title:
|
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR AND A MANUFACTURING METHOD THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO.26, DATONG RD., HUKOU TOWNSHIP, |
| HSINCHU COUNTY, TAIWAN 303 |
|
|
|
|
| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
|
|
Search Results as of:
09/23/2024 08:26 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
