Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/18/2018
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Application #:
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15599477
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Filing Dt:
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05/19/2017
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Publication #:
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Pub Dt:
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03/15/2018
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Inventors:
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Nan-Chun Lin, Hung-Hsin Hsu
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Title:
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CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR AND A MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.26, DATONG RD., HUKOU TOWNSHIP, |
| HSINCHU COUNTY, TAIWAN 303 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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