Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/25/2018
|
Application #:
|
14735229
|
Filing Dt:
|
06/10/2015
|
|
Publication #:
|
|
Pub Dt:
|
12/15/2016
| | | | |
|
Inventors:
|
Hui-Ying Ding, Pengnian Wang, Tao Yu, Jun-Feng Liu, Jun-Kai Bai, Chih-Ping Peng
|
|
Title:
|
LEAD FRAME WITH CONDUCTIVE CLIP FOR MOUNTING A SEMICONDUCTOR DIE WITH REDUCED CLIP SHIFTING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 150 MOTOR PARKWAY |
| HAUPPAUGE, NEW YORK 11788 |
|
|
|
|
| MAYER & WILLIAMS PC |
| 928 MOUNTAIN AVENUE |
| MOUNTAINSIDE, NJ 07092 |
|
|
Search Results as of:
05/30/2024 01:43 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
