Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/08/2019
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Application #:
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15559780
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Filing Dt:
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09/19/2017
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Publication #:
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Pub Dt:
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03/08/2018
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Inventors:
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Luyu Duanmu, Junde Zhang, Qinglin Song
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Title:
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PACKAGING STRUCTURE OF INTEGRATED SENSOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.268 DONGFANG ROAD |
HI-TECH INDUSTRY DISTRICT, WEIFANG CITY |
SHANDONG, CHINA 261031 |
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ALSTON & BIRD LLP |
BANK OF AMERICA PLAZA |
101 SOUTH TRYON STREET, SUITE 4000 |
CHARLOTTE, NC 28280-4000 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BUILDING 10, GOER PHASE II INDUSTRIAL PARK |
NO. 102, RONGHUA ROAD, RONGHUA COMMUNITY, XINCHENG SUBDISTRICT OFFICE, HIGH TECH DEVELOPMENT ZONE |
WEIFANG CITY, SHANDONG, CHINA |
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BAKER BOTTS LLP |
30 ROCKEFELLER PLAZA |
44TH FLOOR |
NEW YORK, NY 10112 |
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09/23/2024 02:55 PM
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