Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/15/2019
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Application #:
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15176240
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Filing Dt:
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06/08/2016
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Publication #:
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Pub Dt:
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12/14/2017
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Inventors:
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Rainer Markus Schaller, Goran Keser, Manuel Harrant
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Title:
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CHIP PACKAGE, A CHIP PACKAGE SYSTEM, A METHOD OF MANUFACTURING A CHIP PACKAGE, AND A METHOD OF OPERATING A CHIP PACKAGE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AM CAMPEON 1-12 |
NEUBIBERG, GERMANY 85579 |
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VIERING, JENTSCHURA & PARTNER MBB |
C/O 3770 HIGHLAND AVE, |
SUITE 203 |
MANHATTAN BEACH, CA 90266 |
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09/26/2024 04:45 PM
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