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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/05/2019
Application #:
15653638
Filing Dt:
07/19/2017
Publication #:
Pub Dt:
01/24/2019
Inventors:
James McMahon, Ryan S. Smith, Nicholas V. LiCausi, Errol Todd Ryan, Xunyuan Zhang et al
Title:
VIA AND SKIP VIA STRUCTURES
Assignment: 1
Reel/Frame:
043041/0364Recorded: 07/19/2017Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/03/2017
Exec Dt:
07/10/2017
Exec Dt:
07/06/2017
Exec Dt:
07/03/2017
Exec Dt:
07/03/2017
Exec Dt:
07/05/2017
Assignee:
PO BOX 309
UGLAND HOUSE
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104
Correspondent:
ANDREW M. CALDERON
7918 JONES BRANCH DRIVE, SUITE 500
MCLEAN, VA 22102
Assignment: 2
Reel/Frame:
054452/0776Recorded: 11/17/2020Pages: 53
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/15/2020
Assignee:
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD, SUITE 100 EAST
FALLS CHURCH, VA 22042-1248

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