Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/12/2019
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Application #:
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15534196
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Filing Dt:
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06/08/2017
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Publication #:
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Pub Dt:
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04/19/2018
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Inventors:
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Ming YIN, Hao TANG
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Title:
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WAFER DE-BONDING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING 14-108, 818 QIMING ROAD |
| YINZHOU DISTRICT, NINGBO CITY |
| ZHEJIANG, CHINA 315100 |
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| DENTONS US LLP - PETER SU |
| 1530 PAGE MILL ROAD |
| SUITE 200 |
| PALO ALTO, CA 94304 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 900 CALLE PLANO, UNIT N |
| CAMARILLO, CALIFORNIA 93012 |
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| HAO TANG |
| 900 CALLE PLANO |
| CAMARILLO, CA 93012 |
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