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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/19/2019
Application #:
15816247
Filing Dt:
11/17/2017
Publication #:
Pub Dt:
03/15/2018
Inventors:
Bing-Joe Hwang, Wei-Nien Su, Jeng-Ywan Jeng, Yuan-Han Chu, Tse-Ming Chiu, Hsin-Fu Teng
Title:
APPARATUS FOR CUTTING SUBSTRATE AND SYSTEM FOR PROCESSING SAME
Assignment: 1
Reel/Frame:
044189/0285Recorded: 11/21/2017Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/21/2016
Exec Dt:
01/21/2016
Exec Dt:
01/21/2016
Exec Dt:
01/21/2016
Exec Dt:
01/21/2016
Exec Dt:
01/21/2016
Assignee:
NO. 43, SEC 4, KEELUNG ROAD
DA'AN DIST.
TAIPEI 106, TAIWAN (ROC)
Correspondent:
C. FREDERICK KOENIG III
VOLPE AND KOENIG P.C.
30 S 17TH STREET, 18TH FLOOR
PHILADELPHIA, PA 19103

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