Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/19/2019
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Application #:
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15895411
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Filing Dt:
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02/13/2018
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Publication #:
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Pub Dt:
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06/21/2018
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Inventor:
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Yeongseok Kim
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| ONELLO & MELLO, LLP |
| 3 BURLINGTON WOODS DRIVE |
| SUITE 203 |
| BURLINGTON, MA 01803 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME AND CORRESPONDENCE ADDRESS PREVIOUSLY RECORDED ON REEL 044922 FRAME 0782. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| JOHN A. CASTELLANO |
| 11730 PLAZA AMERICA DRIVE, SUITE 600 |
| HARNESS, DICKEY & PIERCE. P.L.C. |
| RESTON, VA 20190 |
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