Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/19/2019
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Application #:
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14453199
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Filing Dt:
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08/06/2014
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Publication #:
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Pub Dt:
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02/11/2016
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Inventors:
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Sai-Mun LEE, Chee-Pin T'NG
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Title:
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IMAGE MODULE PACKAGE WITH TRANSPARENT SUB-ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PHASE III BAYAN LEPAS FREE INDUSTRIAL ZONE |
| PENANG, MALAYSIA 11900 |
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| LOWE HAUPTMAN & HAM, LLP |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5F, NO. 5, INNOVATION ROAD I |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU COUNTY, TAIWAN |
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| HAUPTMAN HAM, LLP |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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