Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/26/2019
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Application #:
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15783455
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Filing Dt:
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10/13/2017
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Inventor:
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Yee Loy LAM
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Title:
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METHOD FOR WAFER-LEVEL SEMICONDUCTOR DIE ATTACHMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6 CHANGI NORTH STREET 2 |
| SINGAPORE, SINGAPORE 498831 |
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| CHANDRAN IYER C/O GOLDBERG SEGALLA LLP |
| 711 3RD AVENUE, SUITE 1900 |
| NEW YORK, NY 10017 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 780 MONTAGUE EXPRESSWAY |
| SUITE 107 |
| SAN JOSE, CALIFORNIA 95131 |
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| LYNN LEHNERT |
| 8000 MARYLAND AVE |
| SUITE 640 |
| ST. LOUIS, MO 63105 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTIES PREVIOUSLY RECORDED AT REEL: 49560 FRAME: 275. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 780 MONTAGUE EXPRESSWAY |
| SUITE 107 |
| SAN JOSE, CALIFORNIA 95131 |
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| DR. TUE NGUYEN |
| 496 OLIVE AVE. |
| FREMONT, CA 94539 |
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