Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/26/2019
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Application #:
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15674247
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Filing Dt:
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08/10/2017
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Publication #:
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Pub Dt:
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11/23/2017
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Inventor:
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Yaojian Lin
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Title:
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Semiconductor Device and Method of Making Embedded Wafer Level Chip Scale Packages
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 500 LINJIANG ROAD |
| YUECHENG DISTRICT |
| SHAOXING, CHINA |
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| ROBERT D. ATKINS |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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