Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/26/2019
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Application #:
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15167757
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Filing Dt:
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05/27/2016
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Inventors:
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Suebphong Yenrudee, Chanapat Kongpoung, Sant Hongsongkiat, Siriwanna Ounkaew et al
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Title:
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SEMICONDUCTOR PACKAGE WITH PLATED METAL SHIELDING AND A METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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22 ANG MO KIO INDUSTRIAL PARK 2 |
SINGAPORE, SINGAPORE 569506 |
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THOMAS B. HAVERSTOCK |
162 N WOLFE ROAD |
SUNNYVALE, CA 94086 |
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09/23/2024 10:22 AM
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