Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/26/2019
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Application #:
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15619812
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Filing Dt:
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06/12/2017
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Publication #:
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Pub Dt:
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01/04/2018
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Inventors:
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Hem Takiar, Chin-Tien Chiu
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Title:
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SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTED PACKAGE ON PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 388, JIANG CHUAN EAST ROAD |
| MINHANG DISTRICT |
| SHANGHAI, CHINA 200241 |
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| VIERRA MAGEN MARCUS LLP |
| 575 MARKET STREET, SUITE 3750 |
| SAN FRANCISCO, CA 94105 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5601 GREAT OAKS PKWY |
| LEGAL DEP. |
| SAN JOSE, CALIFORNIA 95119 |
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| WESTERN DIGITAL TECHNOLOGIES |
| 5601 GREAT OAKS PKWY |
| LEGAL DEP. |
| SAN JOSE, CA 95119 |
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