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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/02/2019
Application #:
15219429
Filing Dt:
07/26/2016
Publication #:
Pub Dt:
07/20/2017
Inventors:
Sang Hyun PARK, Chung-Yul YOO, Hong Soo KIM, Min Soo SUH, Dong Kook KIM, Byung jin CHO
Title:
HIGH-TEMPERATURE STRUCTURE FOR MEASURING PROPERTIES OF CURVED THERMOELECTRIC DEVICE, AND SYSTEM AND METHOD FOR MEASURING PROPERTIES OF CURVED THERMOELECTRIC DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
039470/0966Recorded: 07/26/2016Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/14/2016
Exec Dt:
07/14/2016
Exec Dt:
07/14/2016
Exec Dt:
07/15/2016
Exec Dt:
07/15/2016
Exec Dt:
07/15/2016
Assignees:
152 GAJEONG-RO, YUSEONG-GU
DAEJEON, KOREA, REPUBLIC OF 34129
291, DAEHAK-RO, YUSEONG-GU
DAEJEON, KOREA, REPUBLIC OF 34141
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE NW
SUITE 800
WASHINGTON, DC 20037

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