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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/02/2019
Application #:
12231965
Filing Dt:
09/08/2008
Publication #:
Pub Dt:
03/11/2010
Inventors:
Damion Searls, Weston C. Roth, Margaret D. Ramirez, James D. Jackson, Charles A. Gealer et al
Title:
Mainboard assembly including a package overlying a die directly attached to the mainboard
Assignment: 1
Reel/Frame:
022688/0253Recorded: 05/15/2009Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/10/2008
Exec Dt:
09/11/2008
Exec Dt:
09/11/2008
Exec Dt:
09/12/2008
Exec Dt:
09/12/2008
Exec Dt:
09/22/2008
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95052
Correspondent:
CHRISTINE HARTNESS
C/O CPA GLOBAL, P.O. BOX 52050
MINNEAPOLIS, MN 55402
Assignment: 2
Reel/Frame:
062437/0329Recorded: 01/19/2023Pages: 47
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/29/2021
Assignee:
3101 N. 1ST STREET
SAN JOSE, CALIFORNIA 95134
Correspondent:
BYRNE POH LLP
400 RELLA BLVD
STE 165 #106
SUFFERN, NY 10901

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