Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/23/2019
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Application #:
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15343172
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Filing Dt:
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11/03/2016
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Publication #:
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Pub Dt:
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05/03/2018
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Inventors:
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Wai Wong Chow, On Lok Chau
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Title:
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LEADLESS PACKAGE WITH NON-COLLAPSIBLE BUMP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 411 E. PLUMERIA DRIVE, MS41 |
| SAN JOSE, CALIFORNIA 95134 |
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| INTELLECTUAL PROPERTY AND LICENSING NXP |
| 411 EAST PLUMERIA DRIVE, MS41 |
| SAN JOSE, CA 95134 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HIGH TECH CAMPUS 60 |
| EINDHOVEN, NETHERLANDS 5656 AG |
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| INTELLECTUAL PROPERTY AND LICENSING NXP |
| 411 EAST PLUMERIA DRIVE, MS41 |
| SAN JOSE, CA 95134 |
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Assignment:
3
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| JONKERBOSPLEIN 52 |
| 6534 AB NIJMEGEN, NETHERLANDS |
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| OHLANDT, GREELEY, RUGGIERO & PERLE, LLP |
| ONE LANDMARK SQUARE, 10TH FLOOR |
| STAMFORD, CT 06901-2682 |
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