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Patent Assignment Abstract of Title
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Total Assignments: 6
Patent #:
10272684
Issue Dt:
04/30/2019
Application #:
15253601
Filing Dt:
08/31/2016
Publication #:
20170190174
Pub Dt:
07/06/2017
Inventors:
David S. HUNT, Dana GRUENBACHER, Simon DODD, Joseph Edward SCHEFFELIN et al
Title:
SUPPORT SUBSTRATES FOR MICROFLUIDIC DIE
Assignment: 1
Reel/Frame:
048229/0025Recorded: 02/04/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
DODD, SIMON
Exec Dt:
07/27/2016
Assignee:
STMICROELECTRONICS, INC.
750 CANYON DRIVE
SUITE 300
COPPELL, TEXAS 75019
Correspondent:
SEED IP LAW GROUP LLP
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104
Assignment: 2
Reel/Frame:
048228/0980Recorded: 02/04/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SCHEFFELIN, JOSEPH EDWARD
Exec Dt:
07/28/2016
HUNT, DAVID S.
Exec Dt:
07/28/2016
Assignee:
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2
AGRATE BRIANZA, ITALY 20864
Correspondent:
SEED IP LAW GROUP LLP
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104
Assignment: 3
Reel/Frame:
048229/0018Recorded: 02/04/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
GRUENBACHER, DANA
Exec Dt:
03/07/2018
SCHOEBER, UWE
Exec Dt:
03/08/2018
HOLLINGER, STEFAN H.
Exec Dt:
03/12/2018
JANOUCH, PETER
Exec Dt:
03/14/2018
Assignee:
THE PROCTER & GAMBLE COMPANY
ONE PROCTER & GAMBLE PLAZA
CINCINNATI, OHIO 45202
Correspondent:
SEED IP LAW GROUP LLP
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104
Assignment: 4
Reel/Frame:
048464/0806Recorded: 02/28/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
THE PROCTER & GAMBLE COMPANY
Exec Dt:
03/12/2018
Assignee:
STMICROELECTRONICS INTERNATIONAL N.V.
SCHIPHOL BOULEVARD 265
SCHIPHOL, NETHERLANDS 1118 BH
Correspondent:
SEED IP LAW GROUP LLP
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104
Assignment: 5
Reel/Frame:
058835/0877Recorded: 01/31/2022Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
STMICROELECTRONICS, INC.
Exec Dt:
01/21/2022
Assignee:
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39
PLAN-LES-OUATES
GENEVA, SWITZERLAND 1228
Correspondent:
SEED IP LAW GROUP LLP
701 5TH AVE
SUITE 5400
SEATTLE, WA 98104
Assignment: 6
Reel/Frame:
059246/0754Recorded: 03/11/2022Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
STMICROELECTRONICS S.R.L.
Exec Dt:
02/02/2022
Assignee:
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39
PLAN-LES-OUATES
GENEVA, SWITZERLAND 1228
Correspondent:
SEED INTELLECTUAL PROPERTY LAW GROUP LLP
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104

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