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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/30/2019
Application #:
15884919
Filing Dt:
01/31/2018
Publication #:
Pub Dt:
03/28/2019
Inventors:
Jr-Sheng CHEN, Yu-Pei CHIANG, Chin-Han MENG, Chih-Hsien HSU, Lin-Ching HUANG
Title:
METHOD FOR MANUFACTURING MICROELECTROMECHANICAL SYSTEM STRUCTURE HAVING A CAVITY AND THROUGH-HOLES OF DIFFERENT WIDTHS
Assignment: 1
Reel/Frame:
047361/0122Recorded: 10/30/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/05/2018
Exec Dt:
10/05/2018
Exec Dt:
10/05/2018
Exec Dt:
10/05/2018
Exec Dt:
10/05/2018
Assignee:
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
BIRCH STEWART KOLASCH & BIRCH LLP
8110 GATEHOUSE ROAD, SUITE 100 EAST
FALLS CHURCH, VA 22042-1248

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