Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/30/2019
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Application #:
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15855305
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Filing Dt:
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12/27/2017
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Publication #:
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Pub Dt:
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05/17/2018
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Inventors:
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Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Ying-Hao Kuo, Kuo-Chung Yee, Tien-Yu Huang
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Title:
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Package and Method for Integration of Heterogeneous Integrated Circuits
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
HSIN-CHU SCIENCE PARK |
HSIN-CHU, TAIWAN 300-77 |
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ESCHWEILER & POTASHNIK, LLC |
ROSETTA CENTER |
629 EUCLID AVE., SUITE 1000 |
CLEVELAND, OH 44114 |
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05/30/2024 04:42 AM
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