Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/07/2019
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Application #:
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15797159
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Filing Dt:
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10/30/2017
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Publication #:
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Pub Dt:
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05/03/2018
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Inventors:
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Dong In HA, Tae Gon KANG, Seung Shik SHIN, Da Heen JEONG, Ki Hong CHOI
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Title:
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THERMOPLASTIC RESIN COMPOSITION AND ARTICLE PRODUCED THEREFROM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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334-27, YEOSUSANDAN-RO |
YEOSU-SI, JEOLLANAM-DO |
YEOSU-SI, KOREA, REPUBLIC OF 59616 |
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MELISSA B. PENDLETON |
10706 SIKES PLACE |
SUITE 350 |
CHARLOTTE, NC 28277 |
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06/27/2024 01:26 PM
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