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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/14/2019
Application #:
15855563
Filing Dt:
12/27/2017
Publication #:
Pub Dt:
05/03/2018
Inventors:
Marko Lemke, Stefan Tegen, Rolf Weis
Title:
Methods of Manufacturing a Semiconductor Device with a Buried Doped Region and a Contact Structure
Assignment: 1
Reel/Frame:
044492/0946Recorded: 12/27/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/26/2015
Exec Dt:
11/26/2015
Exec Dt:
11/26/2015
Assignee:
KOENIGSBRUECKER STR. 180
DRESDEN, GERMANY 01099
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518
Assignment: 2
Reel/Frame:
067699/0648Recorded: 06/12/2024Pages: 6
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/29/2018
Assignee:
KÖNIGSBRÜCKERSTR. 180
DRESDEN, GERMANY 01099
Correspondent:
VANYA PEYCHEVA
AM CAMPEON 1-15
NEUBIBERG, 85579 GERMANY

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